Effect of the oxygen flow rate on the structure and the properties of Ag–Cu–O sputtered films deposited using a Ag/Cu target with eutectic composition

Abstract

Ag–Cu–O films were deposited on glass substrates by reactive sputtering of a composite Ag 60Cu 40 target in various Ar–O 2 mixtures. The films were characterised by energy dispersive X-ray analysis, X-ray diffraction, UV–visible spectroscopy and using the four point probe method. The structure of the films is strongly dependent on the oxygen flow rate introduced in the deposition chamber. The variation of the oxygen flow rate allows the deposition of the following structures: Ag–Cu–(O) solid solution, nc-Ag + nc-Cu 2O, nc-Ag + nc-(Ag,Cu) 2O and finally X-ray amorphous. UV–visible reflectance measurements confirm the occurrence of metallic silver into the deposited films. The increase of the oxygen flow rate induces a continuous increase of the film oxygen concentration that can be correlated to the evolution of the film reflectance and the film electrical resistivity. Finally, the structural changes vs. the oxygen content are discussed in terms of reactivity of sputtered atoms with oxygen.