Abstract
The correlated regularities of the variations in the structural and phase composition and morphological and field-emission characteristics of the surface-structured р- and n-Si crystals upon stepwise highdose ion-beam carbon processing are studied. It is shown that the stepwise high-dose ion implantation of carbon atoms into the surface of silicon wafers structured using nonlithographic carbon mask coatings makes it possible to reduce field-emission thresholds and increase the densities of the maximum field-emission currents by more than two orders of magnitude relative to the values for emitter arrays fabricated using traditional microelectronic technologies. The physicochemical mechanisms responsible for modifying the surface properties of silicon structures upon carbon ion implantation are discussed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
