Abstract
The electrochemical migration characteristics of Sn-Pb alloys were studied using water drop and anodic dissolution tests. Additionally, the correlation between the alloy composition and the failure time in a water-drop test was investigated. It was revealed that the shape of the filament was affected by the alloy composition, which is believed to be caused by the different anodic dissolution and passivity behavior with respect to the composition. It was found that the shape of the filament is closely related to the failure time in the water-drop test. The Pb-rich phase forms dendrite-shaped filaments, while the Sn-rich phase forms globular filaments. A high Sn content in the Sn-Pb ally, which has a high fraction of Sn-rich phases, leads to globular filaments and shows a long failure time.
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