Abstract
The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue reliability and morphological patterns of three solder compositions: Sn-4Ag-0.5Cu, Sn-3.5Ag-1Cu, and Sn-3Ag-1.5Cu, subjected to two test conditions consisting of different average current densities and ambient temperatures (5kA∕cm2 at 150°C and 20kA∕cm2 at 30°C). It is interesting to realize that as the Cu weight content of the solder composition increases, the fatigue life increases under 5kA∕cm2 at 150°C but decreases under 20kA∕cm2 at 30°C. Observed electromigration morphologies along with computed current density and temperature distributions on solder interconnects from the electrothermal coupling analysis were examined, correlated, and discussed.
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