Abstract
AbstractSU‐8 photoresist is an ideal thermal‐imprinting polymer, which has been widely used in micro‐nano devices in recent years. However, the research on the filling behavior of SU‐8 photoresist during thermal nanoimprinting is not complete. In this paper, the stress relaxation curves and shear stress/rate flow curves were measured to analyze the temperature dependent rheological properties of SU‐8 photoresist. The filling behavior of SU‐8 photoresist was discussed based on thermal imprinting results at various temperatures. High‐precision nanochannels were fabricated with replication error of 2.8% at optimized thermal imprinting temperature of 85°C and duration of 10 min, which paves the way for high‐precision fabrication of SU‐8‐based micro‐nanofluidic chips.
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