Abstract
The effect of temperature on the sputtering yield of copper for low energy argon ion bombardment is investigated. Experimentally, a phase sensitive technique utilizing the spectroscopic emission of sputtered particles is discussed. Analytically, the Langberg model for the sputtering yield is expanded to include the effect of temperature. Atoms of the bombarded surface attain a steady state distribution in the number of their bonds. Changes in either the temperature or the bombardment parameters result in changes in the distribution leading to variations in the sputtering yield. (111) and (110) single crystal and poly crystalline copper surfaces are investigated. Reasonable agreement is obtained between experimental and analytic yield values. The (111) surface shows the largest decrease in yield with an increase in temperature.
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