Abstract
This paper presents the characteristics of thin film copper strips due to sulfur corrosion at different temperatures. Thin film copper with a layer thickness of 200 nm was deposited onto a glass substrate using an electron beam evaporator. In order to enhance the adhesion of thin film copper on the glass substrate, titanium with a layer thickness of 5 nm was deposited prior to copper evaporation. Three dibenzyl disulfide (DBDS) concentrations were chosen to simulate the different levels of oil corrosiveness: (1) 100, (2) 250, and (3) 1000 ppm. The thin film copper strips were immersed in the corrosive oil samples and then aged in a forced convection laboratory oven at 120 and 130°C for 25 h. The copper loss due to sulfur corrosion was monitored by measuring the resistance of the thin film copper strips using the 4-wire measurement method. Based on the preliminary results, sulfur corrosion is accelerated by increasing the temperature from 120 to 130°C. The amount of copper losses from the glass substrate caused by the corrosive by-products due to the breakdown of DBDS is more pronounced at higher temperature, as evidenced from the measured resistance values.
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