Abstract
Vitrified ultrafine diamond grinding wheels are ideal for machining next-generation semiconductor power device material, such as SiC etc. However, a crucial problem limiting the application of ultrafine diamond originates from the dispersion of aggregates in vitrified bond. In this study, in can be confirmed that the preparation of uniformly dispersed diamond/vitrified bond composites using sol-gel technique is feasible. Surfactants with various types and additions interactively promote the dispersion of diamond, which make both the bending strength and diamond dispersion of the composites are suitable for precision grinding. The results are valuable for the preparation of vitrified grinding wheels with ultrafine diamond for precision machining of semiconductor.
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