Abstract
The interfacial adhesion energy between the resist and the substrate is very important in nanoimprinting because of problems with the resist sticking or pulling off during separation of the mold from the substrate. Substrate surface treatments with a self-assembled monolayer or oxygen plasma provide good adhesion between a resist coating and a silica substrate. In this paper, we describe the adhesion properties of a resist and a glass wafer measured using the four-point bending test. The interfacial adhesion energy between the resist and the glass wafer was evaluated for various substrate surface treatments of adhesion promoters and anti-sticking layers. The interfacial fracture energy without treatment was 1.23 J/m 2, and was in the range 0.49–2.57 J/m 2 for the other treatments tested. The interfacial fracture surfaces were also investigated by field emission scanning electron microscopy, energy dispersive spectroscopy, and X-ray photoelectron spectroscopy to determine the fracture mode at the interfaces.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
