Effect of surface treatment and cleaning on the bond strength to polymer-infiltrated ceramic network CAD-CAM material

Abstract

Statement of problemOptimal composite resin bonds to polymer-infiltrated ceramic network (PICN) computer-aided design and computer-aided manufacturing (CAD-CAM) materials are essential for clinical success. However, comparative bond strength studies on the influence of different etching and cleaning methods on these materials are lacking. PurposeThe purpose of this in vitro study was to measure and compare the microshear bond strength (μSBS) of a composite resin cement with that of a PICN material after different surface treatment and cleaning methods. Material and methodsSeventy specimens of a CAD-CAM PICN were divided into 7 groups (n=10): no treatment (control), hydrofluoric acid etching for 20 seconds (HF20), 60 seconds (HF60), 120 seconds (HF120), HF20 + phosphoric acid for 60 seconds and ultrasonic bath for 5 minutes, HF60 + PH, and HF120 + PH. After surface treatment, a silane coupling agent and composite resin cement were applied. Microshear bond strength was determined, and data were analyzed with 1-way ANOVA and Tukey post hoc multiple comparison tests (α=.05). ResultsAll HF acid treatments resulted in a significant increase in bond strength to the polymer-infiltrated ceramic network material (P=.02). Bond strength values for HF etching for 20 seconds were significantly lower than those for 60 seconds and 120 seconds (P=.034). No difference was found between 60 seconds and 120 seconds of HF etching time (P=.986). Additional surface treatment with phosphoric acid 60 seconds and ultrasonic bath 5 minutes did not improve the bond strength beyond values obtained by hydrofluoric acid treatment only (P=.834). Most failures were cohesive. ConclusionsAcid etching and surface treatment have significant effects on composite resin bond strength to a PICN CAD-CAM material. HF etching for 60 seconds or 120 seconds provides the highest bond strengths. Cleaning methods after etching did not have any significant effect on bond strength.