Abstract
One of the most pressing challenges facing today's electronics packaging industry is to identify reliable and cost-effective solder alloys to replace toxic lead containing solder. Besides evaluating new alloy compositions and improving the soldering process, it is important to understand how surface finishes applied to the copper metallization affect the joint characteristics. The characterization of intermetallics during the early stages of nucleation and the growth is hindered by the nanoscopic grain size and layer thickness. This study investigates the impact of PCB finish and solder type on the interfacial intermetallics. Five types of solder and four types of finishes were used: Sn37Pb (SP), Sn3.5Ag (SA), Sn3.5Ag0.7Cu (SAC), Sn2Ag0.5Cu4Bi (SACB) and Sn3Bi8Zn (SBZ) solders, combined with immersion Silver ( I – Ag ), electroless Nickel-immersion Gold (ENIG), Organic Solderability Preservative (OSP) and immersion Tin ( I – Sn ). It was shown that both the SP and SAC solders follow a parabolic growth model and that the surface finish has a significant effect on the intermetallic morphology and growth kinetics. A combined SEM and XRD investigation was shown to be a suitable method for characterizing nanoscale intermetallics.
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