Abstract
In the present investigation, the effect of substructures on hardness and conductivity during partial annealing of cold-rolled copper was studied. Substructures were observed after annealing at lower temperature; however, the annealed sample (at higher temperature) was mostly free from substructures. Therefore, it is proposed that the restoration mechanism at lower temperature envisages recovery in copper; however, it is partial recrystallization at higher temperature. There was an increase in hardness observed at lower temperature due to higher fraction of substructures, while an increase in conductivity was observed at higher temperature due to partial recrystallization. It was confirmed that the twin boundaries produced during cold rolling provided dislocations pinning, leading to greater tensile strength.
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