Abstract
The dynamic properties of inkjet-printed Ag thin films on flexible substrates were measured using flexural wave propagation. The Ag nanoparticle suspension was inkjet-printed on polyimide (PI), silicon wafer, and glass. The effects of flexible substrates on the dynamic properties of the films were investigated. Beam-shaped Ag-printed substrates were fabricated by pico-second laser pulse cutting. The wave approach was presented to analyze the vibrations of the thin film on the substrates. The Young’s modulus and loss factor of the Ag thin films with the substrates were represented by the combined bending stiffness of the bilayer beam. The vibration response of the base-excited cantilever was measured using an accelerometer and laser Doppler vibrometer (LDV). Vibration transfers were analyzed to obtain dynamic characteristics of the Ag-printed bilayer beam. The substrate affects the reduction of the Ag thin film thickness during the sintering process and surface roughness of the film. The proposed method based on the wave approach allows measurement of the dynamic properties regardless of the ratio of the modulus between the thin film and substrate.
Highlights
With the interest in alternatives to traditional photolithography, inkjet printing has attracted considerable attention in various printed electronics applications such as flexible displays, electronic skins, flexible solar cells, and thin-film transistors [1,2,3,4,5,6]
The proposed method based on the wave approach introduced pressure, to measure
Densification is known to be affected was by temperature, thethe number of modulus and loss factor of inkjet-printed
Summary
With the interest in alternatives to traditional photolithography, inkjet printing has attracted considerable attention in various printed electronics applications such as flexible displays, electronic skins, flexible solar cells, and thin-film transistors [1,2,3,4,5,6]. When the indenter is pressed into the specimen, the Young’s modulus is obtained from the load–displacement curves This method using an indenter causes damage to the specimen due to plastic deformations [23]. Modal analysis is a common method to measure the dynamic properties of a beam. The measured resonance frequencies generally encounter assorted unwanted conditions such as noise and nonlinear responses These aspects require complicated signal processing to accurately measure the properties of the beams. The Young’s modulus and loss factor of Ag thin films with the substrates were represented by the combined bending stiffness of the bilayer beam. The proposed method allows the dynamic properties of the thin film on arbitrary substrates to be determined. The inkjet-printed Ag thin films were evaluated through vibration transfer without plastic deformation of the specimens
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
