Abstract
Effect of Cu foil substrate surface conditions on the electrochemical performance of Si thin film anode was investigated on four substrate surface conditions, smooth Cu foil, island-shaped s Cu foil, roughened Cu foil with sandpaper, and Cu foil implanted by plasma immersion lanthanum ion implantation (LaPIII). The relationship of effect significant with the thickness of Si was identifiedned. Sample on island-shaped surface and LaPIII treated on one showed better performance. For the thicker Si films, more roughness is better for the substrate. An optimized substrate surface condition according to the film thickness is necessary for the deposition of Si films.
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