Abstract
Wetting behaviors of Sn-0.7Cu on amorphous Fe84.3Si10.3B5.4 substrate and substrates annealed at various temperatures (i.e., 400 °C, 500 °C and 650 °C ) were investigated at 250 °C, 300 °C, 350 °C and 400 °C by the sessile drop method, and the interfacial reaction of Sn-0.7Cu on different Fe84.3Si10.3B5.4 substrates with different annealing treatments were studied by scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS). Obtained results show that at the same soldering temperature, the final equilibrium wetting angle of Sn-0.7Cu on Fe84.3Si10.3B5.4 substrates gradually increases with the increase of annealing temperature. That means the wettability becomes worse and the interfacial reaction becomes weaker. With the increase of soldering temperature from 250 °C to 400 °C, the final equilibrium wetting angle of Sn-0.7Cu on Fe84.3Si10.3B5.4 substrates decreases gradually, suggesting a better wettability.
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