Abstract
Surface plasmon polaritons associated with light-nanoparticle interactions can result in dramatic enhancement of electromagnetic fields near and in the gaps between the particles, which can have a large effect on the sintering of these nanoparticles. For example, the plasmonic field enhancement within nanoparticle assemblies is affected by the particle size, spacing, interlayer distance, and light source properties. Computational analysis of plasmonic effects in three-dimensional (3D) nanoparticle packings are presented herein using 532 nm plane wave light. This analysis provides insight into the particle interactions both within and between adjacent layers for multilayer nanoparticle packings. Electric field enhancements up to 400-fold for transverse magnetic (TM) or X-polarized light and 26-fold for transverse electric (TE) or Y-polarized light are observed. It is observed that the thermo-optical properties of the nanoparticle packings change nonlinearly between 0 and 10 nm gap spacing due to the strong and nonlocal near-field interaction between the particles for TM polarized light, but this relationship is linear for TE polarized light. These studies help provide a foundation for understanding micro/nanoscale heating and heat transport for Cu nanoparticle packings under 532 nm light under different polarization for the photonic sintering of nanoparticle assemblies.
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