Abstract
The effect of sputtering-cleaning on adhesion and chemical bonding at the metal/polymer interface was studied. Titanium (Ti) films were deposited on polymer substrates, polyethylene and polytetrafluoroethylene (PTFE) after sputtering-cleaning treatment. The sputteringcleaning treatment consisted of argon ion irradiation at 0.3 keV. Adhesion was measured by a pull test, and the chemical bonding at the interface was investigated by X-ray photoelectron spectroscopy. Adhesion of both polymer substrates was improved by sputtering-cleaning. In the case of PE, the ratio of C-Ti bonding at the interface increased after sputtering-cleaning and resulted in adhesion improvement. C-Ti and F-Ti bonding appeared at the interface between the Ti film and the PTFE substrate, but improvement in adhesion of Ti/PTFE was attributed to the change of the interfacial morphology on the basis of the scanning electron spectroscopy observation and adhesion of Au to PTFE.
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