Abstract
A sintered Ti1 3 Cu 87 bi-component target was sputtered by reactive DC magnetron sputtering in nitrogen ambient under various sputtering powers. Ti included Cu 3 N (Ti:Cu 3 N) thin films were deposited on Si (1 1 1), KBr (potassium bromide), quartz and glass slide substrates. Crystalline phases of the films were identified by X-ray diffraction (XRD) technique. Crystalline quality and phase stability are strongly dependent on sputtering power. Formation of copper vacancies in Cu 3 N cell substituted by Ti atoms and subsequent excess of interstitial nitrogen (N-rich) result in lattice constant expansion. Bonding environment in these films was obtained from fourier transform infrared (FTIR) spectroscopy. Surface morphology of the films that were studied by a scanning electron microscope (SEM) indicates a granular structure. Atomic Ti:Cu ratio of Ti:Cu 3 N films, determined by energy dispersive X-ray (EDX) spectroscopy, is less than that of original target. Optical study was performed by Vis-near IR transmittance spectroscopy. Film thickness, refractive index and extinction coefficient were extracted from the measured transmittance using pointwise unconstrained minimization approach. The TiCu 3 N films are direct semiconductor with bandgap energy with the range of 2.79–3.34 eV. Ti incorporation and subsequent N-rich have a significant role in bandgap widening and lattice constant expansion. The films electrically show quasi-metallic behavior.
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