Abstract
Spin coating is a simple process for rapidly depositing thin, solid polymeric films onto relatively flat substrates. Evaporation occurs during spinning of the relatively volatile species in any solution. The curing behavior of spin-coated polymeric film is influenced by the evaporation of any reactive component. An investigation was carried out on a silicon substrate to study the effects of spin coating on the curing behavior of the epoxy adhesive. The degree of curing for both spin and without spin-coated epoxy adhesive was measured by Fourier-transform infrared spectroscopy (FTIR). A slower curing reaction rate was observed for the spin-coated epoxy adhesive. The composition gradient established by solvent evaporation during spinning is responsible for the slower curing reaction rate of the spin-coated epoxy adhesive. From this study, it is proposed to use solvents that are less volatile and allow a greater part of the thinning behavior to occur without significant changes in the fluid properties during the spinning process.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.