Effect of some service conditions on the electrical resistivity of conductive styrene–butadiene rubber–carbon black composites

Abstract

AbstractConductive polymer composites were prepared using vulcanized styrene–butadiene rubber as a matrix and conductive carbon black as a filler. The filler loading was varied from 10 to 60 phr. The volume resistivity was measured against the loading of the carbon black to verify the percolation limit. The electrical conductivity of filled polymer composites is attributed to the formation of some continuous conductive networks in the polymer matrix. These conductive networks involve specific arrangements of conductive elements (carbon black aggregates) so that the electrical paths are formed for free movement of electrons. The effects of temperature and pressure on the volume resistivity of the composites were studied. The volume resistivity of all the composites increased with increase in temperature, and the rate of increase in the resistivity against temperature depended on the loading of carbon black. The change in volume resistivity during the heating and cooling cycle did not follow the same route, leading to the phenomena of electrical hysteresis and electrical set. It was found that the composites with 40 and 60 phr carbon black become more conductive after undergoing the heat treatment. Generally, all the composites showed a positive temperature coefficient of resistivity. The volume resistivity of all the composites decreased with increase in pressure. The relaxation characteristic of the volume resistivity of the composites was studied with respect to time under a constant load. It was found that the volume resistivity of the compressed specimen of the composites decreased exponentially with time. It was observed that initially a faster relaxation process and later a slower relaxation process occurred in these composites. Some mechanical properties of these composites were also measured to confirm the efficacy of these composites for practical applications. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 2179–2188, 2004