Abstract
Solder paste plays a significant role in the SMT (Surface Mount Technology) of electronic products. It has become an urgent task in the field of surface mounting to develop the matching flux. The purpose of this paper is to investigate the relationship of solder paste component with rheological properties and printing performance. In this study, Sn–0.3Ag–0.7Cu solder powder was applied. The effect of solvent agents on the rheological properties and jet printing performance of solder paste was investigated systematically with a combined method. The rheological methods consisting of viscosity test, thixotropic loop test, oscillation stress sweep test, creep recovery test and jet printing test. From this study, it was found that the compound alcohols solvent has an evident viscoelastic behavior which presents a superior printability. S5 solder paste with high viscosity and small loss coefficient G″/G′ exhibits an excellent printability. The largest thixotropic loop area and unrecovered stress value of solder paste can be jetted smoothly. Besides, solder paste with high creep recovery value in jet printing can obtain better shape.
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