Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

Abstract

This paper investigates the effect of soldering temperature on solder joint voids and reliability of flip-chip LED chips during reflow soldering. Lead-free solder SAC305 was used as solder paste. The void ratio of the flip-chip LED solder joint at 250°C, 260°C, 270°C, 280°C, and 290°C reflow soldering temperatures was detected by x-ray detector. Shear tests were conducted to evaluate the influence of interfacial reactions on the mechanical reliability of solder joints. The distribution of voids in the shear section was observed by scanning electron microscope (SEM). Next, the photoelectric and thermal properties of FC-LED filament were tested and analyzed. Finally, a high-temperature and high-humidity aging experiment was carried out to test the reliability of the LED filament. The results show that the void ratio of the LED filament soldering joint is the lowest when the soldering temperature is 270°C. The small void ratio of the solder joints results in lower steady-state voltage and junction temperature of the flip-chip LED filament. As the void density in the solder joint decreases, the shear strength of the solder joint increases. At this time, the shear resistance and mechanical reliability are the highest.