Abstract
The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. In addition, grain boundaries did not play an important role in Cu diffusion because they are mostly cyclic twins.
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