Abstract
Dendrite coherency is important to the formation of the solidification structure. The coherency point is a temperature at which the microstructure starts to bridge and develop some mechanical resistance. It is still too early in the solidification process for hot tearing to develop. Dendrite coherency point (DCP) characteristics in Al–Si binary alloys have been studied by double thermocouples method during solidification process. The results indicate that the DCP and solid fraction at DCP are decreased with an increase in silicon concentration. As for the unrefined Al–xSi (x = 1, 3, 5, 7 and 9 wt%) system alloys, the solid fraction at DCP varies from 0.14 to 0.38 and the corresponding dendrite coherency temperature varies from 598.6 to 653.8 °C. In addition, there is an approximate nonlinear relationship between DCP and silicon concentration. For the binary Al–Si hypoeutectic alloys, the change of DCP is not obvious by the grain refinement and modification treatment for the melt.
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