Abstract

Aluminium rods with different copper sheath thicknesses were processed by severe plastic deformation at room temperature and then annealed, to join the constituent metals and produce a nanocrystalline microstructure. A study of the effects of the deformation parameters, copper cladding thickness and annealing temperature on the electrical conductivity and hardness of the conductors is reported. It is shown that an interface forms between constituents because of intermixing in the course of severe shear deformation under high hydrostatic pressure and diffusion during the subsequent annealing. The effective conductivity of the aluminium copper-clad conductor dropped after deformation, but was recovered during annealing, especially during short annealing at 200 °C, to a level exceeding the theoretically predicted one. In addition, the annealing resulted in increased hardness at the interface and copper sheath.

Highlights

  • Copper-clad aluminium (CCA) wire is a well-known conductor produced by extrusion of an aluminium rod in a copper can

  • The interface formed between aluminium and copper consists of a number of intermetallic compounds, the formation of which depends on the annealing temperature and duration

  • Extreme grain refinement was observed in the deformed hybrid samples, especially in the outer copper cladding where friction added to the severity of the shear strain

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Summary

Introduction

Copper-clad aluminium (CCA) wire is a well-known conductor produced by extrusion of an aluminium rod in a copper can. The interface formed between aluminium and copper consists of a number of intermetallic compounds (up to 13 stable intermetallic phases according to Murray [7]), the formation of which depends on the annealing temperature and duration The conductivity of these phases is shown to be many times lower than that of the constituent materials [5,6]. A study of the effect of SPD parameters, copper cladding thickness, and annealing temperature on the electrical conductivity and strength of CCA conductors is reported below. Samples were subjected to one and two passes of equal channel angular pressing (ECAP) using thickness, and annealing temperature on the electrical conductivity and strength of CCA conductors is.

The Grain during SPD
Interface Formation during Room Temperature Deformation
Hardness
Electrical Conductivity
Conclusions
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