Abstract
Cu nanopaste is a candidate to replace Ag nanopaste, but the oxidation problems associated with Cu nanopaste must be overcome. In this study, we fabricated Cu nanopaste with various contents of sodium dodecylbenzene sulfonate (SDBS), and the oxidation behaviors of Cu nanopaste with various contents of SDBS were investigated. Then, Cu nanopastes were printed using a screen-printing machine and sintered with infrared energy. The fabricated circuits were evaluated using high-temperature storage tests and steady-state temperature humidity bias life testing. The printed Cu pattern with SDBS showed better oxidation-resistant properties than that without SDBS. After the reliability test, 2 wt% of SDBS shows less oxide based on X-ray diffraction, microstructure, and electrical resistivity measurements, and the optimized content of SDBS was 2 wt% in the Cu nanopaste.
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