Abstract
AbstractFlexible conducting materials are required for the design and fabrication of a host of applications involving flexible electronic items. A flexible substrate like paper or polymer is generally employed for deposition of metal by a variety of processes. Among many physical properties, the roughness of the substrate is considered an important parameter, although, its exact role on effective conductivity of the coating is not known. Nor any study has been carried out to understand how the three‐dimensional porous structure of the substrate surface affects the microscopic packing of grains that constitute the metal coating. With the objective of elucidating the effect of substrate roughness on the conductivity of paper electrodes, we have used six different commonly available papers for vacuum coating with copper. For a smooth substrate, the grains that constitute the coating appear spherical, however, turns ellipsoidal as the substrate roughness and heterogeneity is increased; ellipsoidal grains result in higher packing efficiency leading to higher conductivity. We have also presented a model to relate the packing efficiency to the asphericity, polydispersity, and skewness of size distribution of grains.
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