Abstract
We studied the effects of various plasma etching gases on a silver nanoparticle (AgNP) layer to find the proper etching conditions compatible with the AgNP printing process. An AgNP layer with thickness of 1.4 μm was prepared by spin-coating a AgNP suspension on a glass wafer; O2, CF4, and SF6 plasma were then individually treated on the AgNP layer for 1 min and for 10 min. The surface properties, elemental composition, and sheet resistance were measured in order to study the effects of plasma exposure on AgNP layer. Small particles and deposited materials were observed on the surface after treating with O2 and CF4 plasma, respectively, while large particles were grown by re-crystallization after SF6 plasma exposure. In summary, O2 plasma has the least damage to the AgNP layer, showing good surface properties and sheet resistance. CF4 plasma showed moderate results, and the SF6 plasma severely damaged the AgNP layer.
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