Effect of Remelting Temperature and Soaking Time on Microstructure and Mechanical Properties of the Thixoformed Part of Nano-Sized SiCp/7075 Composite

Guanfei Xiao,Jufu Jiang,Xi Nie,Ying Wang,Yingze Liu

doi:10.3390/met8090709

Abstract

Semisolid billet of the 7075 aluminum matrix composite reinforced with nano-sized SiC particles was first fabricated by an ultrasonic-assisted semisolid stirring method and rheoforming technology. Then it was thixoformed into a cylinder part under different remelting temperatures and soak times. The effects of the remelting temperature and soaking time on the mechanical properties and microstructure of the thixoformed composite part were investigated. The results show that parts of good quality were thixoformed successfully. The microstructure of the top side wall of the thixoformed part consisted of near spheroidal grains. A large quantity of elongated grains occurred in the medium and bottom side walls and the bottom itself. With increasing remelting temperatures, the size of the solid grains of the thixoformed parts showed a trend of first to increase and afterwards to decrease. High density dislocations were found in the microstructure when the remelting temperatures were 590 °C and 600 °C. When the soaking time was 15 min, the severest deformation occurred in the thixoformed part. High mechanical properties of the thixoformed parts were achieved under conditions such as a remelting temperature between 590 °C and 600 °C and a soaking time between 10 min and 15 min. The fracture mode of the thixoformed part changed from transgranular fracture to intergranular fracture when the remelting temperature was elevated from 580 °C to 610 °C. After the thixoformed parts were treated by T6, the ultimate tensile strength (UTS) and elongation of the side wall were improved to 552 MPa and 7.9%, respectively. Dispersed MgZn2 precipitates created by T6 heat treatment led to an improvement of the mechanical properties.

Highlights

The rheforming is referred to as a forming technology in which a semisolid slurry with spheroidal solid grains and liquid phase is carried directed into the die cavity and formed into the final part
The thixoforming is defined as a forming technology in which a semisolid slurry with spheroidal solid grains and liquid is first fabricated, solidified into solid billet, quantitatively cut, reheated to semisolid temperature, and formed into the final parts
Nano-sized SiC particles with an average size of 80 nm were used as reinforcement of the composite

Summary

Introduction

Semisolid processing (SSP) developed by M.C. Flemings and D.B. Spencer from the MIT is a typical near-net-shape technology [1,2]. Spencer from the MIT is a typical near-net-shape technology [1,2] It has exhibited an obvious advantage versus conventional casting and forging [3]. The rheforming is referred to as a forming technology in which a semisolid slurry with spheroidal solid grains and liquid phase is carried directed into the die cavity and formed into the final part. The thixoforming is defined as a forming technology in which a semisolid slurry with spheroidal solid grains and liquid is first fabricated, solidified into solid billet, quantitatively cut, reheated to semisolid temperature, and formed into the final parts.

Methods

Results

Conclusion