Abstract

Atomic layer deposition (ALD) is renowned for its step coverage in porous substrates. Several emerging applications require a combination of this high step coverage with high throughput ALD, like spatial ALD. Often, high throughput ALD is performed at atmospheric pressure, and therefore, the effect of reactor pressure on the saturation dose is investigated. ALD inside porous substrates is governed by three key parameters: the reaction probability, the pore aspect ratio, and the precursor diffusion coefficient, of which the latter one contains the reactor pressure dependency. The effect of these parameters on the saturation dose is validated using Monte Carlo modeling, where the reactor pressure dependency is included through the mean free path. A reaction-limited and a diffusion-limited regime can be identified, and it is shown that for many realistic experimental conditions, even at low reactor pressures, the saturation dose is in the diffusion-limited regime. An expression for the pressure dependent saturation dose in the diffusion-limited regime is derived. For small pore diameters, the saturation dose is pressure independent, but for larger pores, higher saturation doses are required for atmospheric reactor pressures than for low reactor pressures. However, as high reactor pressures enable much higher precursor partial pressures than low reactor pressures, the resulting saturation times can be much shorter at atmospheric pressure than low pressure. Often, high surface area porous substrates will lead to supply limited conditions, and increased saturation times have to be taken into account. These results show that the atmospheric pressure ALD can be used for high throughput ALD inside porous substrates, as long as high precursor partial pressures and molar flows can be applied. This is experimentally demonstrated by a near 100% step coverage obtained by atmospheric spatial ALD of alumina in high aspect ratio pores.

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