Abstract
Effect of pulse reverse current on the microstructure of a copper electro-deposition was studied to make copper-mesh on a transparent polyimide (PI) film for electromagnetic interference materials. Thiourea as an organic additive in a modified copper sulfate bath significantly influenced micro-structure of the deposits. Smooth surface and preferred orientation were observed in the layers with the organic additive. Square wave pulse was more useful to produce a micro-sized copper-mesh.
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