Abstract
In this study, effects of panel density and adhesive ratio on some physical and mechanical properties of peanut (Arachis hypogaea L.) hull particleboards for general purposes were investigated. Panels were manufactured with various densities (0.5, 0.6, 0.7, and 0.8 g/cm3) and adhesive ratios (core layer 8-9% and face layer 10-11%) using urea-formaldehyde (UF) as an adhesive. All panels were tested for some mechanical (internal bond, modulus of elasticity, and modulus of rupture) and physical (water absorption and thickness swelling) properties. Results indicated that increase in the panel density and adhesive ratio, resulted in an improvement in mechanical and physical properties. Only the panels with 0.8g/cm3 density almost met the requirements for the TS-EN 312 Standard for general purposes. Also, the boards having the lower mechanical properties tested in this study can be used as insulating material in buildings because such materials would not be subjected to any mechanical stress.
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