Abstract
In this work, Cu-Ni-Si alloy was prepared by hot-pressing sintering using Cu, Ni, and Si powders as raw material. The alloy was afterwards exposed to solution treatment at 900 °C for 2 h and aging at 450 °C for 4 h. The microstructural analysis revealed that the alloy was mainly composed of the granular Ni31Si12 phase at the grain boundaries and the fine δ-Ni2Si phase inside the grains after hot-pressing sintering. After solution treatment, the Ni2Si phase disappeared completely while a small quantity of Ni31Si12 was still observed. However, there was a large amount of fibrous δ-Ni2Si precipitates after aging. The mechanical properties and electrical conductivity of the alloy were tested as well. After aging, the alloy exhibited the best comprehensive characteristics with the hardness of 248.6 HV and the conductivity of 40% IACS. Therefore, the banded structure of Cu-Ni-Si alloys prepared by powder metallurgy and subjected to aging exerts a positive influence on their properties.
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