Effect of Pr Addition on Properties of Sn-0.5Ag-0.7Cu-0.5Ga Lead-Free Solder

Abstract

In this paper, the effect of Pr addition on the microstructure and properties of Sn-0.5Ag-0.7Cu-0.5Ga lead-free solder was investigated. It was found that the properties of Sn-0.5Ag-0.7Cu-0.5Ga-xPr solder, such as wettability and mechanical properties, could be obviously improved, and the optimal content of Pr was about 0.06 wt.%. The microstructure of Sn-0.5Ag-0.7Cu-0.5Ga-0.06Pr solder showed that the β-Sn matrix and intermetallic compound (IMC) grains were significantly refined, and refinement and homogenization of the microstructure achieved maximum efficiency, which played the role of fine grain strengthening and second phase strengthening. However, as the content of Pr exceeded 0.06 wt.%, some uneven distributed black phases of PrSn3 were found in the β-Sn matrix, which seriously worsened the microstructure and properties of the solders. As a surface-active element, the segregation of Pr at the molten solder interface could give rise to decreasing the interface tension. Consequently, adding a suitable amount of Pr could play a positive role in improving the properties of the solders.