Abstract
In this work, smooth spherical and irregular granular copper powders were deposited on copper and aluminium substrates through the kinetic spray deposition process in order to find the effect of the feedstock powder state on the deformation process and the deposition behaviour. The effect of the initial state of powder on the coating properties was analysed through scanning electron microscopy, Vickers microhardness tester, electrical resistivity and bond strength characterizations. Simulation for two kinds of powders was performed through ABAQUS explicit 6.7-2 finite element analysis using a dynamic explicit procedure. Powder–substrate interface properties were estimated for two kinds of powders and discussed in order to compare the experimental results. It is found that the coatings produced from irregular granular powder have higher bonding properties.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
