Abstract

The effect of post-implantation annealing (PIA) on Al–N isoelectronic trap (IET) formation in silicon has been experimentally investigated to discuss the Al–N IET formation and implantation-induced defect recovery mechanisms. We performed a photoluminescence study, which indicated that self-interstitial clusters and accompanying vacancies are generated in the ion implantation process. It is supposed that Al and N atoms move to the vacancy sites and form stable Al–N pairs in the PIA process. Furthermore, the PIA process recovers self-interstitial clusters while transforming their atomic configuration. The critical temperature for the formation/dissociation of Al–N pairs was found to be 450 °C, with which we describe the process integration for devices utilizing Al–N IET technology.

Highlights

  • The tunnel field-effect transistor (TFET) is a type of steep-slope transistor that shows promise for achieving a much steeper subthreshold swing (SS) compared to that of conventional metal-oxidesemiconductor FETs and for realizing large-scale-integration (LSI) with low power consumption.[1,2]

  • The Al-N pair acts as the isoelectronic trap (IET) in Si, and it has been utilized for TFETs.[11]

  • One is the high-temperature stability of the Al-N IET, which is important from the perspective of thermal budget control in the entire device fabrication process

Read more

Summary

Introduction

The tunnel field-effect transistor (TFET) is a type of steep-slope transistor that shows promise for achieving a much steeper subthreshold swing (SS) compared to that of conventional metal-oxidesemiconductor FETs and for realizing large-scale-integration (LSI) with low power consumption.[1,2]. Takahiro Mori,a Yukinori Morita, and Takashi Matsukawa Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST), Tsukuba, Ibaraki 305-8568, Japan (Received 26 March 2018; accepted 14 May 2018; published online 22 May 2018) PIA processes to form Al–N IETs in silicon from the perspectives of Al–N IET formation and defect generation by utilizing photoluminescence (PL) measurements.

Results
Conclusion

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.