Abstract

This study aimed to evaluate the effect of heat treatment on the physical and mechanical properties of particleboard from sugarcane bagasse. The experiment consisted of seven treatments arranged in a 2 × 3 factorial arrangement (two heat treatment times – 8 and 12 min, and three heat treatment temperatures – 200 °C, 230 °C, and 260 °C) and treatment control (without heat treatment). We evaluated the properties such as apparent density, water absorption after 2 and 24 h (WA2h andWA24h), thickness swell after 2 and 24 h (TS2h and TS24h), irreversible thickness swelling rate (ITS), internal bond, Modulus of Elasticity (MOE), and Modulus of Rupture (MOR) in static bending. In general, the use of heat treatment appeared very promising for improving the dimensional stability of sugarcane bagasse particleboard, without being made unviable by the mechanical properties reduction.

Highlights

  • Particleboard industries consume a significant amount of wood from planted forests, mainly of Pinus and Eucalyptus genera

  • The heat treatment performed in the particleboard at 260 °C for 12 min promoted a significant panel density reduction

  • Taking into account that the increase in the thickness results in an increase in the volume of the panel and that the panel density is given by the ratio between mass and volume, it is possible that the panel density reduction with thermal treatment resulted mainly in the function of the increase in their thickness

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Summary

Introduction

Particleboard industries consume a significant amount of wood from planted forests, mainly of Pinus and Eucalyptus genera. In principle, these panels can be produced from any lignocellulosic material that provides high mechanical strength and good physical characteristics[1,2,3]. The Brazilian agroindustry offers many types of lignocellulosic residues, which have potential for particleboards production such as corncob, rice husk, coffee hull, peanut hull, banana plant stem, coconut husk, cassava stem, castor bean hull, sugarcane bagasse, etc.[3,4]. Some studies on the use of bagasse for the production of particleboard have revealed its significant potential[2,4,7,8,9,10]. Because of its low density, a large amount of bagasse particles is required to form the panel, causing an increase in the compressive stress at pressing time and a greater number of hygroscopic sites, making the panel more susceptible to water absorption and dimensional change

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