Abstract
Two types of porogens were tested to prepare porous low dielectric films. PCL porogens as well as Tetronic block copolymer porogens generate pores within the films thus lowering the dielectric constant. Tetronic porogens, however, yield porous films without significant matrix-porogen interactions and thus result in higher mechanical properties with lower dielectric constant, when compared with the PCL porogens.
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