Effect of Plating and Anneal Processes on Properties of Electroplated Copper Films

Abstract

Electroplated copper film has been used extensively in large scale integrated circuits as a conducting metal for interconnect. Therefore, the investigation on the correlations between film properties and process parameters is of great significance. This paper describes the effect of various plating parameters, including plating current, thickness of plated film, wafer rotation speed, and anneal process on the properties of electroplated copper films. The properties investigated are stress, sheet resistance, roughness, reflectance and grain size of electroplated copper conductive layers.