Abstract
Results from measurements of the electrical resistivity of copper and aluminum conductors under the action of a plane shock wave, and also analysis of the relationship between the electrical resistivity and the hydrostatic pressure and of the theoretical temperature dependence of the electrical resistivity, has made it possible to elucidate the role of defect formation due to the plastic deformation of the metal and to determine its contribution to the increase in electrical resisitivity of the metal. It has been established that the concentration of defects depends on the pressure gradient in a plane shock wave.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
