Abstract
α‐alumina of different particle sizes of 50 nm, 0.4, 3, and 7 μm have been incorporated into the PTFE matrix to prepare flexible composite substrates. A proprietary process comprising of sigma mixing, extrusion, and calendering, followed by hot pressing (SMECH process) has been used to obtain dimensionally stable ceramic‐filled PTFE substrates. Variation of the dielectric constant, loss tangent and moisture absorption of filled PTFE composites has been ascertained as a result of filler loading.
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