Abstract
In order to ensure long lifetime and stable light output of LEDs the thermal performance parameters need to be designed in the LED chip package and module level, which include such items as heat sink structure and materials, interface materials and substrates. In this work we used aluminium nitride(AlN) as submount of LED chips and made chip on board(COB) type LED module. The effect of different silver(Ag) epoxy bonding materials and bonding methods on the performance of LED module were examined. The effect of addition of red quantum dot(QD) on the performance of white LED was also studied.
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