Abstract
The adsorption effect of a new inhibitor “p-toluenesulfonylhydrazide (p-TSH)” on copper corrosion in 0.5 M HCl solution was studied by weight loss, electrochemical methods, morphological characterization and quantum chemical calculations. Electrochemical impedance spectroscopy and potentiodynamic polarization produced the same results, indicating that p-TSH reduces the corrosion rate of copper as its concentration increases in acidic solutions, provided that the adsorption mechanism of the inhibitor obeyed the Langmuir isotherm. The results of scanning electron microscopy suggested the possible adsorption of p-TSH molecules on the Cu(111) surface. In addition, quantum chemical simulations were used to explain the p-TSH inhibition performance for the copper.
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