Abstract
The effect of oxide thickness on the coalescence of Sn–3.5Ag–0.5Cu solder pastes is investigated by introducing a specific chemical removal process. The native oxide film is inevitably formed when solder powders are dried in vacuum at 25 °C after the chemical removal. The results reveal that the oxide films before and after chemical removal are mostly composed of SnO and SnO 2. This process has little influence on the oxide composition or the morphology of solder powders while the thickness of the oxide film decreases from 5.6 nm to 2.7 nm, approximately reduced by 50%. The oxide thickness thinning process plays an effective part in improving the coalescence of solder pastes.
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