Abstract
We investigated the performance of single-structured light-emitting electrochemical cell (LEC) devices with Ru(bpy)3(PF6)2 polymer composite as an emission layer by controlling thickness and heat treatment. When the thickness was smaller than 120–150 nm, the device performance decreased because of the low optical properties and non-dense surface properties. On the other hand, when the thickness was over than 150 nm, the device had too high surface roughness, resulting in high-efficiency roll-off and poor device stability. With 150 nm thickness, the absorbance increased, and the surface roughness was low and dense, resulting in increased device characteristics and better stability. The heat treatment effect further improved the surface properties, thus improving the device characteristics. In particular, the external quantum efficiency (EQE) reduction rate was shallow at 100 °C, which indicates that the LEC device has stable operating characteristics. The LEC device exhibited a maximum luminance of 3532 cd/m2 and an EQE of 1.14% under 150 nm thickness and 100 °C heat treatment.
Highlights
IntroductionPublisher’s Note: MDPI stays neutral with regard to jurisdictional claims in published maps and institutional affiliations
We investigated the correlation between luminescence characteristics and morphological and optical properties of light-emitting electrochemical cell (LEC) devices according to the indium tin oxide (ITO)/ emission layer/Ag structure with changes in the thickness and heat treatment temperatures
The 260 nm thick thin film had too much surface roughness, which interfered with the recombination of the electric charges, resulting in efficiency roll-off and poor device stability
Summary
Publisher’s Note: MDPI stays neutral with regard to jurisdictional claims in published maps and institutional affiliations. Organic light-emitting diode (OLED) technology is used widely in highly energyefficient displays and has always attracted worldwide attention. There are many issues to find a solution to the high manufacturing cost and long processing time [1,2]. The fabrication process requires the precise control of multi-layers such as the hole injection layer (HIL), the hole transport layer (HTL), the emitting layer (EML), the electron transport layer (ETL), and the electron injection layer (HIL) for high-resolution and large-area display, which complications finding solutions to the issue of high cost and manufacturing time
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