Abstract
We have developed a loop thermosyphon for cooling electronic devices. The cooling performance of a thermosyphon deteriorates with an increasing amount of non-condensable gas (NCG). Design of a thermosyphon must consider NCG to provide guaranteed performance for a long time. In this study, the heat transfer performance of a thermosyphon was measured while changing the amount of NCG. The resultant performances were expressed as approximations. These approximations enabled us to predict the total thermal resistance of the thermosyphon by the amount of NCG and input heating. Then, using the known leakage in the thermosyphon and the amount of dissolved NCG in the water, we can predict the amount of NCG and the total thermal resistance of the thermosyphon after ten years. Although there is a slight leakage in the thermosyphon, we are able to design a thermosyphon with a guaranteed level of cooling performance for a long time using the proposed design method.
Highlights
Electronic devices need to be more compact these days, but it has become difficult to cool them sufficiently with existing air cooling systems that use only heat conductivity
We have developed a loop thermosyphon to provide high cooling performance for electronic devices [1,2]
We propose a design method of a thermosyphon with a guaranteed level of cooling performance for a long time
Summary
Electronic devices need to be more compact these days, but it has become difficult to cool them sufficiently with existing air cooling systems that use only heat conductivity. One is that it has a porous structure that enhances evaporative heat transfer for the evaporation section to decrease thermal resistance Another is that the position of the radiator can be freely adjusted by extending the joint pipes. Webb et al [6] studied a thermosyphon using a sintered boiling surface and louver fins to cool desktop computers to dissipate 100 W Their working fluid was R-134A and water. Samba et al [7] reported on thermal performance of a loop thermosyphon for cooling telecommunication equipment to dissipate 600 W The effect of the amount of NCG on heat transfer performance of the loop thermosyphon was investigated. We propose a design method of a thermosyphon with a guaranteed level of cooling performance for a long time
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