Effect of N‐methylimidazole and 3,5‐dimethylpyrazole ligands on the polymerization of di(2,6‐dichlorophenolato) Cu(II)/Co(II) complexes in the solid state

Abstract

AbstractThe polymerization of 2,6‐dichlorophenol (DCPH) was achieved through the thermal decomposition of copper complexes of DCPH with N‐methylimidazole (NMIz) and 3,5‐dimethylpyrazole (DMPz) ligands. Fourier transform infrared (FTIR), differential scanning calorimetry (DSC), mass spectrometry, ultraviolet–visible spectroscopy, diffuse reflectance spectroscopy, magnetic susceptibility balance, electron spin resonance, X‐ray analysis, and elemental analysis were used to characterize the complexes. The polymerization was achieved either in the solid state or in the melt. The structural analyses were performed with FTIR and NMR spectroscopy analyses. The glass‐transition temperatures were determined by DSC, and the intrinsic viscosities were determined by viscosimetry. The effects of the temperature and time on the conversion percentage and viscosity of the polymers were examined. Varying the decomposition temperature during a 3‐h scan showed that the DMPz complex of Cu decomposed at lower temperatures than the NMIz complex, whereas the NMIz complex yielded a higher conversion to the polymer. Complexes of DCPH with NMIz and DMPz ligands produced 1,2‐ and 1,4‐addition products, respectively. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 91: 3797–3805, 2004