Abstract
With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.
Highlights
Under the drive of device miniaturization, high-density packaging technologies, such as ball grid array (BGA), chip scale package (CSP), and wafer level packaging (WLP), have been applied in the advanced electronical equipment, which decreases the joint size and calls for excellent property of packaging materials [1]
Lots lotsofofresearch research results have achieved in nanoparticle-reinforced lead-free
Results have beenbeen achieved in nanoparticle-reinforced lead-free solder, solder, there are still several shortages existing in the application of the composite solder
Summary
Under the drive of device miniaturization, high-density packaging technologies, such as ball grid array (BGA), chip scale package (CSP), and wafer level packaging (WLP), have been applied in the advanced electronical equipment, which decreases the joint size and calls for excellent property of packaging materials [1]. To meet the actual requirement of electronic industries, packaging materials for electronic devices are required to have perfect electrical conductivity, wettability, and mechanical properties, and low cost and high reliability. Compared with ECAs, the development of lead-free solder alloys with better reliability, thermal, and electrical properties to replace SnPb solders has always been one of research focuses in the field of microelectronic joining. Researchers mainly improve the performance of lead-free solders by microalloying and nanoparticles strengthening. In order to comply with the trend of green development and meet the requirements of the electronics industry for packaging materials, the influence of nanoparticles doping on the microstructure and properties of lead-free solders was analyzed comprehensively, which is expected to provide some theoretical reference for the development of high-performance nanoparticle-reinforced lead-free solders
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