Abstract
The creep behavior of the AgSnO2 contact materials with different nano-metal additives (Fe, Ni, Cu) was investigated at room temperature. The fracture surface was characterized by scanning electron microscope (SEM). The creep behavior and mechanism of the AgSnO2 materials without addition and with Cu, Fe and Ni were simulated and analyzed. It was found that the creep strain and creep rate of the AgSnO2 materials were obviously decreased due to the improvement of interface wettability between Ag and SnO2 by the incorporation of metal additive. The Cu additive exhibited the most remarkable effect on improving the creep resistance, following by Fe, Ni. The creep strain of the AgSnO2(Cu) materials was significantly decreased, about 60% lower than that of the material without additives. The experimental creep curves of the AgSnO2 materials with different nano additives agreed well with the Norton-Bailey power law. Moreover, the nano metal additives played a role in preventing or slowing creep voids growth which could be attributed to the interface strength enhancement and the improved load-transfer capability, evidenced by ABAQUS software. This work can provide a useful guideline for the optimization and design of Ag-matrix contact materials.
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