Abstract

Abstract In this work, we have optimized the device structure to achieve a maximum drain current of Nanoelectronic AlGaN/GaN single-heterojunction high electron mobility transistors (HEMTs) by the variations of mole fraction, doping concentration and gate length, using the SILVACO-ATLAS software tool. The drain current increases at higher aluminium mole fraction of AlGaN nano-layer. The drain current increases at higher doping concentration of AlGaN nano-layer. The drain current reduces at higher gate length of HEMTs. The conduction band engineering in terms of quantum wells is investigated in detail by involving the Bose-Einstein expression. The simulation results of this work are supported by the available previous experimental results and analytical modelling. This work will be useful to fabricate the AlGaN/GaN HEMTs experimentally for bioengineering applications.

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